ECIE Lab at Rohde & Schwarz Power Technology Forum | Advancing High-Frequency Power Innovation
As AI servers drive power demands to unprecedented levels, achieving higher efficiency, greater power density, and robust reliability has become a central challenge for modern power electronics. This week, ECIE Lab was invited by Rohde & Schwarz to participate in the Next-Generation AI Server Architecture & Industrial Power Design Challenges Forum, joined by more than 250 professionals from industry and academia.
Keynote Presentation
Prof. Yu-Chen Liu (Taipei Tech / ECIE Lab) delivered the invited talk:
“Driving AI with Core Power: Key Technologies and Design Practices of Intermediate Bus Converters (IBC)”
His presentation examined the role of IBCs in AI server power architectures, focusing on magnetic component integration, early-stage simulation and verification, design optimization, and pathways toward achieving high power density with reliable performance.
ECIE Lab Technology Showcase
Our team presented five advanced high-frequency power converter designs and engaged in deep technical discussions with engineers, system architects, and R&D leaders. Demonstrations included:
- Three-phase LLC resonant converter
- Three-phase Totem Pole PFC control architecture
- 1.2 kW Intermediate Bus Converter (IBC) module
- 1.2 MHz high-frequency Class-D amplifier
- Machine-learning-assisted PFC core-loss analysis platform
These works reflect our ongoing commitment to high-frequency design, magnetic component optimization, high-power-density topologies, and data-driven modeling methodologies.
Event Details
Date: November 17, 2025
Venue: Chang Yung-Fa Foundation International Convention Center
Organizer: Rohde & Schwarz
We appreciate the opportunity to exchange insights with industry leaders. ECIE Lab will continue advancing high-frequency power conversion research to support the evolving energy demands of the AI era.
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